Electronic device

ABSTRACT

The present disclosure provides an electronic device including a display unit, a sensor unit, M first signal lines and N second signal lines. The display unit and the sensor unit are electrically connected to N second signal lines through M first signal lines, M and N are natural numbers, and M is greater than N.

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure

The present disclosure relates to an electronic device; moreparticularly, an electronic device having a sensor.

2. Description of the Prior Art

In general, fingerprint identification can be applied in identityverification. Therefore, with the continuous advancement of technologiesrelated to electronic devices, sensors having fingerprint identificationfunctions to be integrated into various types of electronic devices andbecome widely available for users to manage electronic devices directlythrough fingerprint identification. Additionally, fingerprints can bequickly identified and are difficult to forge; therefore, fingerprintidentification technology can provide convenience and security. Inrecent years, industries have been dedicated to integrating fingerprintidentification functions and display functions into the same electronicdevice while simultaneously providing high resolution display images.Furthermore, sensing technologies are not limited to uses in identifyingfingerprints; applications also include image sensing or touch controlsensing.

SUMMARY OF THE DISCLOSURE

The present disclosure provides an electronic device including a displayunit, a sensor unit, M first signal lines and N second signal lines. Thedisplay unit and the sensor unit are electrically connected to N secondsignal lines through the M first signal lines, M and N are naturalnumbers and M is greater than N.

These and other objectives of the present disclosure will no doubtbecome obvious to those of ordinary skill in the art after reading thefollowing detailed description of the embodiment that is illustrated inthe various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of an electronic device according to afirst embodiment of the present disclosure.

FIG. 2 is a schematic diagram of a sensor unit and a display unitaccording to the first embodiment of the present disclosure.

FIG. 3 is a schematic diagram of a demux unit according to the firstembodiment of the present disclosure.

FIG. 4 is a schematic diagram of an electronic device according to asecond embodiment of the present disclosure.

FIG. 5 is a schematic diagram of a demux unit according to the secondembodiment of the present disclosure.

FIG. 6 is a schematic diagram of a demux unit according to a thirdembodiment of the present disclosure.

FIG. 7 is a schematic diagram of an electronic device according to afourth embodiment of the present disclosure.

FIG. 8 is a schematic sectional view of an electronic device accordingto a fifth embodiment of the present disclosure.

FIG. 9 is a schematic sectional view of an electronic device accordingto a sixth embodiment of the present disclosure.

FIG. 10 is a schematic sectional view of an electronic device accordingto a seventh embodiment of the present disclosure.

FIG. 11 is a schematic sectional view of an electronic device accordingto an eighth embodiment of the present disclosure.

FIG. 12 is an enlarged schematic top view of a region Rx in FIG. 11.

FIG. 13 is a schematic sectional view of an electronic device accordingto a ninth embodiment of the present disclosure.

DETAILED DESCRIPTION

The present disclosure may be understood by reference to the followingdetailed description, taken in conjunction with the embodiments anddrawings as described below. It is noted that, for purposes ofillustrative clarity and being easily understood by the readers, variousdrawings of this disclosure may be simplified schematic diagrams thatpartially illustrate an electronic device; certain components within maynot be drawn to scale. In addition, the number and dimension of eachcomponent shown in drawings are only illustrative and are not intendedto limit the scope of the present disclosure.

Certain terms are used throughout the description and following claimsto refer to particular components. As one skilled in the art willunderstand, electronic equipment manufacturers may refer to a componentby different names. This document does not intend to distinguish betweencomponents that differ in name but not in function. In the followingdescription and in the claims, the terms “include”, “comprise” and“have” are used in an open-ended fashion, and thus should be interpretedto mean “include, but not limited to . . . ”.

It will be understood that when an element or layer is referred to asbeing “on” or “connected to” another element or layer, it can bedirectly on or directly connected to the other element or layer, orintervening elements or layers may be presented. In contrast, when anelement is referred to as being “directly on” or “directly connected to”another element or layer, there are no intervening elements or layerspresented.

The term “electrically connected” may indicate a direct connection or anindirect connection. Two elements may be electrically connected bydirectly contacting each other to transmit electrical signals, and thetwo elements do not have other elements therebetween. Two electricallyconnected elements may transmit electrical signals via another elementbridging therebetween. Elements that are “electrically connected” mayalso be considered as elements that are “coupled.”

Although terms such as first, second, third, etc., may be used todescribe diverse constituent elements, such constituent elements are notlimited by the terms. The terms are used only to discriminate aconstituent element from other constituent elements in thespecification. The claims may not use the same terms, but instead mayuse the terms first, second, third, etc. with respect to the order inwhich an element is claimed. Accordingly, in the following description,a first constituent element may be a second constituent element in aclaim.

It should be noted that the technical features in different embodimentsdescribed in the following description may be replaced, recombined, ormixed with one another to constitute another embodiment withoutdeparting from the spirit of the present disclosure.

An electronic device according to the present disclosure may include adisplay device, an antenna device, or a tiled device, but not limitedthereto. The electronic device may be foldable or flexible electronicdevices. The electronic device may for example be a display device withtouch control functions, image sensing functions, sensing functions forvarious parameters or fingerprint identification functions. Herein, thedisplay device may be a self-emitting type of organic light-emittingdiode (OLED) display, an inorganic light-emitting diode (LED) display, amini light-emitting diode (mini LED) display, a micro light-emittingdiode (micro LED) display, a quantum dot light-emitting diode (quantumdot LED, QLED, QDLED) display, a display using fluorescent materials orphosphorescent materials, other suitable types of displays or acombination of the above types of displays, but not limited thereto.Concepts or principles of the present disclosure may also be applied innon-self-emitting types of displays such as liquid crystal displays(LCDs), but not limited thereto.

The antenna device may for example be a liquid crystal antenna or othertypes of antenna devices, but the present disclosure is not limitedthereto. The tiled device may for example be a tiled display device, atiled antenna device or a combination thereof, but the presentdisclosure is not limited thereto. It should be noted that, theelectronic device may be a combination of the aforementioned devices,but the present disclosure is not limited thereto. Additionally, anouter shape of the electronic device may be rectangular, spherical,polygonal, a shape with a curved edge or other suitable shapes. Theelectronic device may have driving systems, control systems, lightingsystems, shelving systems etc. as peripheral systems to support thedisplay device, the antenna device or the tiled device. In the followingdescription, the display device is illustrative of an example of theelectronic device of the present disclosure but the present disclosureis not limited thereto. When the antenna device or other devices areused as the electronic device, a minimum operating unit thereof may beconsidered as a sub-pixel of the display device, but not limitedthereto.

The sensor of the present disclosure may be applied in optical, thermal,pressure, electromagnetic wave, vibration, sound, gravitational,ultra-sound, length, image, touch or fingerprint sensing without beinglimited to a particular function. Fingerprint sensing is illustrative ofan example of embodiments of the present disclosure, but not limitedthereto.

The display device may include a plurality of sub-pixels arranged nextto each other in multiple rows. In one embodiment, sub-pixels of adisplay device may include green, red and blue sub-pixels, or green,red, blue and yellow sub-pixels, or green, red, blue and whitesub-pixels, such that colored images may be displayed via variouscolored light produced by the sub-pixels, but the present disclosure isnot limited thereto. Colors produced by the sub-pixels may be designedbased on requirements. In another embodiment, the display device may bea single color display device, and all sub-pixels may emit light of asingle color, such as white, red or any suitable color. Additionally, ashape of a top view of the sub-pixel may be a rectangle, aparallelogram, a “>” shape or any suitable shape.

Please refer to FIG. 1 and FIG. 2. FIG. 1 is a schematic diagram of anelectronic device according to a first embodiment of the presentdisclosure. FIG. 2 is a schematic diagram of a sensor unit and a displayunit according to the first embodiment of the present disclosure. Anelectronic device 10 of the present embodiment may include a substrate100 that may include an active region AR and a peripheral region PRadjacent to the active region AR. The peripheral region PR is disposed,for example, on at least one side of the active region AR. As shown inFIG. 1, the peripheral region PR may surround the active region AR. Theactive region AR may have functions including a display function, adetection function, a sensing function or a light-emitting function, butthe present disclosure is not limited thereto. A material of thesubstrate 100 may include glass, quartz, sapphire, polymer (such aspolyimide (PI) or polyethylene terephthalate (PET)) and/or othersuitable materials to be used as a flexible substrate or a rigidsubstrate, but the present disclosure is not limited thereto.Additionally, a shape of a top view of the substrate 100 is not limitedto a rectangular shape; the substrate 100 may have any suitable shape.

The electronic device 10 may include a plurality of signal lines, andthe signal lines may include a plurality of display scan lines L12 and aplurality of data lines L14 disposed on the substrate 100, but thepresent disclosure is not limited thereto. In other embodiments, thesignal lines may include common lines, emitting control lines, powerlines, reset control lines, reference lines, grounding lines, read outlines etc., depending on the type of electronic device. The display scanlines L12 may extend along a first direction D1, the data lines L14 mayextend along a second direction D2, and the second direction D2 may notbe parallel to the first direction D1. In the present embodiment, thefirst direction D1 may be orthogonal to the second direction D2, but thepresent disclosure is not limited thereto. Other signal lines may extendalong the first direction D1 or the second direction D2, but the presentdisclosure is not limited thereto. The display scan lines L12, the datalines L14 or other signal lines may be a straight line, a curved line ora polyline.

In another aspect, the electronic device 10 may include a display unitDU disposed on the substrate 100 and disposed in the active region AR,and the display unit DU may include a plurality of sub-pixels SP. Forexample, the display unit DU may include three sub-pixels, or thedisplay unit DU may include at least a row of sub-pixels, or the displayunit DU may include at least a column of sub-pixels, or the display unitDU may include a plurality of sub-pixels within any given region of theactive region AR, or the display unit DU may include all of thesub-pixels within the active region AR, but the present disclosure isnot limited thereto. The sub-pixel SP includes an element or structureused for display (such as an electrode of a liquid crystal display unit,an OLED display unit or an inorganic LED display unit) and a switch usedto drive the element or structure (such as a thin film transistor).

As shown in FIG. 1, the display scan lines L12 may intersect with thedata lines L14 to define multiple regions, wherein one of the sub-pixelsSP may be correspondingly disposed within one of the regions, but thepresent disclosure is not limited thereto. In other embodiments, theregions may also be defined by different intersecting signal lines, ormultiple sub-pixels SP may be disposed within one of the regions.Additionally, the display unit DU may be electrically connected to thedisplay scan lines L12 and the data lines L14. For example, everysub-pixel SP may be electrically connected to a corresponding displayscan lines L12 and a corresponding data lines L14, but the presentdisclosure is not limited thereto. In other embodiments, the displayunit DU may be electrically connected to different combinations ofsignal lines depending on driving requirements, and every sub-pixel SPmay also be electrically connected to different combinations ofcorresponding signal lines depending on driving requirements.

The sub-pixel SP may include at least one electrode and at least onethin film transistor. As shown in FIG. 2, the sub-pixel SP may includean electrode ED and a thin film transistor TD, and the electrode ED maybe electrically connected to a corresponding thin film transistor TD,but the present disclosure is not limited thereto. In other embodiments,the sub-pixel SP may include multiple electrodes ED or multiple thinfilm transistors TD. In the present embodiment, the electronic device 10may for example include a liquid crystal display panel, and theelectrode ED may for example be a pixel electrode, but the presentdisclosure is not limited thereto. In other embodiments, if theelectronic device 10 is an OLED display panel or an inorganic LEDdisplay panel, the electrode ED may for example be a cathode or ananode. A gate of the thin film transistor TD may be electricallyconnected to the display scan lines L12, a first end of the thin filmtransistor TD may be electrically connected to a corresponding datalines L14, and a second end of the thin film transistor TD may beelectrically connected to a corresponding electrode ED, but the presentdisclosure is not limited thereto. Additionally, the first end and thesecond end of the thin film transistor herein may for example be asource and a drain, or a drain and a source respectively.

As shown in FIG. 1, the electronic device 10 may include a sensor unitSU disposed on the substrate 100 and within a portion of the activeregion AR, and the sensor unit SU may be integrally disposed with thedisplay unit DU, but the present disclosure is not limited thereto. Inother embodiments, the electronic device 10 may also include multiplesensor units SU, the sensor unit SU may also be partially located in theactive region AR and partially located in the peripheral region PR, orthe sensor unit SU may be entirely located within the peripheral regionPR. The sensor unit SU and the display unit DU may also be integrallydisposed and partially overlapped, or separately disposed from thedisplay unit DU without overlapping. An area occupied by the sensor unitSU may be greater than, equal to or less than an area occupied by thedisplay unit DU. For example, an area occupied by an electrode ES of thesub-sensor unit SSU may be greater than, equal to or less than an areaoccupied by an electrode ED of the sub-pixel SP.

As shown in FIG. 2, the signal lines may further include a plurality ofsensing scan lines L22 and a plurality of sensing lines L24. The sensingscan lines L22 may extend along the first direction D1, the sensinglines L24 may extend along the second direction D2, and the sensing scanlines L22 and the sensing lines L24 may be electrically connected to acorresponding sensor unit SU, but the present disclosure is not limitedthereto. In other embodiments, the sensing scan lines L22 may extendalong the second direction D2, and the sensing lines L24 may extendalong the first direction D1. Additionally, one of the sensing scanlines L22 may be disposed adjacent to one of the display scan lines L12,and one of the sensing lines L24 may be disposed adjacent to one of thedata lines L14. Furthermore, the sensing scan lines L22 and the displayscan lines L12 may intersect with the sensing lines L24 and the datalines L14, and the sensing scan lines L22, the display scan lines L12,the sensing lines L24 and the data lines L14 are electrically isolatedfrom each other and may be driven independently, driven in sequence, ordriven synchronously. However, configurations of the sensing scan linesL22, the display scan lines L12, the sensing lines L24 and the datalines L14 are not limited thereto.

As shown in FIG. 2, the sensor unit SU may include a plurality ofsub-sensor units SSU, one sub-sensor unit SSU may be correspondinglydisposed with one sub-pixel SP, and every sub-sensor unit SSU may beelectrically connected to a corresponding sensing scan line L22 and acorresponding sensing line L24, but the present disclosure is notlimited thereto. In other embodiments, the sub-sensor unit SSU may beelectrically connected to different combinations of signal linesdepending on driving requirements. The sub-sensor unit SSU may includeat least one electrode. As shown in FIG. 2, the sub-sensor unit SSU mayinclude an electrode ES, and the electrode ES may be electricallyconnected to a corresponding thin film transistor TS, but the presentdisclosure is not limited thereto. In other embodiments, the sub-sensorunit SSU may include multiple electrodes ES or multiple thin filmtransistors TS, or the sub-sensor unit SSU may be multiple electrodes ESelectrically connected to a corresponding thin film transistor TS, orthe sub-sensor unit SSU may be an electrode ES electrically connected tomultiple corresponding thin film transistors TS. The gate of the thinfilm transistor TS may be electrically connected to the sensing scanline L22, a first end of the thin film transistor TS may be electricallyconnected to a sensing line L24, and a second end of the thin filmtransistor TS may be electrically connected to the electrode ES, but thepresent disclosure is not limited thereto.

An optical sensor is illustrative of an example of the sensor unit SU ofthe present embodiment. Every sub-sensor unit SSU may include an opticalsensor (photodiode), for example a PIN-type diode or other suitablephotoelectric transducers, and the electrode ES may be a lower electrodeelectrically connected to an end of the PIN-type diode, but the presentdisclosure is not limited thereto. The sensor unit SU may also include acapacitive sensor, an ultrasonic sensor, an infrared (IR) sensor orother suitable types of sensors.

As shown in FIG. 1, the electronic device 10 may include a demultiplexer(or demux) 106 disposed on the substrate 100 and in the peripheralregion PR. The demux 106 may be formed on the substrate 100 using a thinfilm deposition process, followed by a photolithography process,followed by an etching process, but the present disclosure is notlimited thereto. The demux 106 may include a demux unit 102 (which mayalso be called a first demux unit) and a demux unit 104 (which may alsobe called a second demux unit), and the demux unit 102 along with thedemux unit 104 may be disposed on a side of the active region AR alongthe second direction D2, but the present disclosure is not limitedthereto. In other embodiments, the demux 106 may only include one of thedemux unit 102 and the demux unit 104, or the demux unit 102 and thedemux unit 104 may be separately disposed on opposite sides of theactive region AR along the second direction D2.

The data lines L14 and the sensing lines L24 may be extended from theactive region AR to the peripheral region PR, the data lines L14 may beelectrically connected to an output end of a corresponding demux unit102, and the sensing lines L24 may be electrically connected to anoutput end of a corresponding demux unit 104, but the present disclosureis not limited thereto. In other embodiments, the data lines L14 may beelectrically connected to the output end of the corresponding demux unit102 and the output end of the corresponding demux unit 104, and thesensing lines L24 may be electrically connected to the output end of thecorresponding demux unit 102 and the output end of the correspondingdemux unit 104. In other embodiments, the demux 106 may only include oneof the demux unit 102 and the demux unit 104. The data lines L14 and thesensing lines L24 may be electrically connected to the same demux unit102 or the same demux unit 104. Or, only the data lines L14 or only thesensing lines L24 may be electrically connected to the demux unit 102 orthe demux unit 104; that is to say, the data lines L14 or the sensinglines L24 may not be electrically connected to the demux unit. In thismanner, the demux unit 102 may be electrically connected to the displayunit DU, and the demux unit 104 may be electrically connected to thesensor unit SU.

On the other hand, the data lines L14 and the sensing lines L24 may becollectively defined as signal lines L1 (which may also be called firstsignal lines). Therefore, within the peripheral region PR, M signallines L1 may include M1 data lines L14 and M2 sensing lines L24. “M” isa number of the quantity of the signal lines L1, “M1” is a number of thequantity of the data lines L14, and “M2” is a number of the quantity ofthe sensing lines L24. The M1 data lines L14 are electrically connectedto the display unit DU, and the M2 sensing lines L24 are electricallyconnected to the sensor unit SU, wherein M1 may be greater than M2, butthe present disclosure is not limited thereto. In other embodiments, M1may be equal to or less than M2. Alternatively, as shown in FIG. 1, theM1 data lines L14 and the M2 sensing lines L24 within the peripheralregion PR may be formed of different conductive layers, and insulatinglayers are present between conductive layers to prevent electrical shortor signal interference between signal lines.

As shown in FIG. 1, the electronic device 10 may include a plurality ofsignal lines L2 disposed on the substrate 100 and within the peripheralregion PR. The signal lines L2 may be connected to an input end of thedemux unit 102 or an input end of the demux unit 104. The demux unit 102may be used to electrically connect the data lines L14 to signal linesL2 a (a portion of the signal lines L2), such that signals may beinputted to or outputted from the sub-pixels SP of the display unit DUthrough a path in a sequence of the signal lines L2 a-the demux unit102-the data lines L14. The demux unit 104 may be used to electricallyconnect the sensing lines L24 to signal lines L2 b (another portion ofthe signal lines L2), such that signals may be inputted to or outputtedfrom the sub-sensor units SSU of the sensor unit SU through a path in asequence of the signal lines L2 b-the demux unit 104-the sensing linesL24, but the present disclosure is not limited thereto. A quantity ofthe signal lines L2 a may be less than a quantity of the data lines L14,and a quantity of the signal lines L2 b may be less than a quantity ofthe sensing lines L24. Therefore, use of the demux unit 102 and/or thedemux unit 104 may reduce a quantity of signal lines used to inputsignals within the peripheral region PR. In other embodiments, aquantity of the data lines L14 may be greater than, equal to or lessthan a quantity of the sensing lines L24, and a quantity of the signallines L2 a may be greater than, equal to or less than a quantity of thesignal lines L2 b.

In summary, the demux 106 may be used to electrically connect M signallines L1 to N signal lines L2 (which may also be called second signallines), and “N” is a number of the quantity of the signal lines L2. Or,the display unit DU and the sensor unit SU may be electrically connectedto N signal lines L2 via M signal lines L1, wherein M may be greaterthan N. Values of M, N, M1 and M2 may be positive integers (or naturalnumbers not including zero). In this manner, a quantity of signal lineswithin the peripheral region PR may be reduced along with a cost ofproduction, time, or a space occupied by the signal lines within theperipheral region PR.

Additionally, the signal lines L2 a and the signal lines L2 b may beformed of the same conductive layer or different conductive layers, thesignal lines L1 connecting the data lines L14 and the signal lines L1connecting the sensing lines L24 may be formed of the same conductivelayer or different conductive layers, the signal lines L1 and the signallines L2 may be formed of the same conductive layer or differentconductive layers, multiple signal lines L1 may be formed of the sameconductive layer or different conductive layers, multiple signal linesL2 may be formed of the same conductive layer or different conductivelayers, the data lines L14 and the sensing lines L24 may be formed ofthe same conductive layer or different conductive layers, multiple datalines L14 may be formed of the same conductive layer or differentconductive layers, multiple sensing lines L24 may be formed of the sameconductive layer or different conductive layers, and multiple scan linesmay be formed of the same conductive layer or different conductivelayers.

Please refer to FIG. 3, which shows a schematic diagram of a demux unitaccording to the first embodiment of the present disclosure. As anexample, the demux unit 102 shown in FIG. 1 is shown in FIG. 3 asincluding a plurality of thin film transistors TP. The thin filmtransistors TP may be arranged into four transistor rows, and the gatesof the thin film transistors TP of every transistor row may beelectrically connected to a switch signal line LS. For example, a dataline L14 a, a data line L14 e, and a data line L14 i may be electricallyconnected to the thin film transistors TP of a transistor row TR1, adata line L14 b, a data line L14 f, and a data line L14 j may beelectrically connected to the thin film transistors TP of a transistorrow TR2, a data line L14 c, a data line L14 g, and a data line L14 k maybe electrically connected to the thin film transistors TP of atransistor row TR3, and a data line L14 d, a data line L14 h, and a dataline L141 may be electrically connected to the thin film transistors TPof a transistor row TR4.

Using the data line L14 a, the data line L14 b, the data line L14 c, andthe data line L14 d as an illustrative example, these data lines may beelectrically connected to a signal line L2 a through thin filmtransistors TP of different transistor rows, and an end of the signalline L2 a may be electrically connected to a bonding pad 110 in order toelectrically connect to an output end of a driving unit (for example, anintegrated circuit chip, IC). Therefore, by activating thin filmtransistors TP of different transistor rows, signals to be sent by thesignal line L2 a may be transmitted to the desired data line L14 as thinfilm transistors turned on or off, thereby achieving an effect of usingone input signal line to correspond to multiple output signal lines.However, a quantity of data lines L14 that may be electrically connectedto one signal line L2 a is not limited to that shown in FIG. 3. Thedemux unit 104 may also have the same or similar technical features asthose mentioned above; for the sake of brevity, a description of suchfeatures is omitted herein.

Please refer to FIG. 1, wherein the electronic device 10 may include adriving unit 108 disposed on the substrate 100 and within the peripheralregion PR. The driving unit 108 may include an integrated circuit chip112 and an integrated circuit chip 114, but a quantity of integratedcircuit chips is not limited thereto. In other embodiments, the drivingunit 108 may only include the integrated circuit chip 112 or onlyinclude the integrated circuit chip 114. In other embodiments, thedriving unit 108 may include multiple integrated circuit chips 112 ormultiple integrated circuit chips 114. The integrated circuit chip 112may be electrically connected to the signal lines L2 a, and theintegrated circuit chip 114 may be electrically connected to the signalline L2 b. In other words, the driving unit 108 may be electricallyconnected to the N signal lines L2. For example, the integrated circuitchip 112 of FIG. 1 may be electrically connected to the bonding pads 110of FIG. 3, and the integrated circuit chip 114 may also have the same orsimilar technical features as the integrated circuit chip 112. In suchmanner, the integrated circuit chip 112 (which may also be called afirst driving unit) may be electrically connected to the display unit DUthrough the signal lines L2 a, the demux unit 102 and the data lines L14(or the signal line L1), whereas the integrated circuit chip 114 (whichmay also be called a second driving unit) may be electrically connectedto the sensor unit SU through the signal lines L2 b, the demux unit 104and the sensing lines L24 (or the signal line L1). The signal lines L2may for example be formed of the same conductive layer, but the presentdisclosure is not limited thereto. Electrically connecting the sensorunit SU to the independent integrated circuit chip 114 may increasesensing speed and accuracy. In some embodiments, the integrated circuitchip 112 and the integrated circuit chip 114 may be integrated into oneintegrated circuit chip.

Additionally, the driving unit 108 may further include at least one gatedriver circuit. The gate driver circuit may be an integrated circuitchip, or the gate driver circuit may be formed on the substrate 100using a thin film deposition process, followed by a photolithographyprocess, and followed by an etching process. As shown in FIG. 1, thedriving unit 108 may include a gate driver circuit 1161 and a gatedriver circuit 1162, and the active region AR may be disposed betweenthe gate driver circuit 1161 and the gate driver circuit 1162 in thesecond direction D2, but the present disclosure is not limited thereto.In other embodiments, the driving unit 108 may only include the gatedriver circuit 1161 or the gate driver circuit 1162, wherein all thescan lines may be driven from a single side. The gate driver circuit1161 may be electrically connected to a portion of the display scanlines L12, and the gate driver circuit 1162 may be electricallyconnected to another portion of the display scan lines L12.Additionally, the gate driver circuit 1161 and the gate driver circuit1162 may be electrically connected to the driving unit 108 (such as theintegrated circuit chip 112), but the present disclosure is not limitedthereto.

In other embodiments, the gate driver circuit 1161, the gate drivercircuit 1162, the integrated circuit chip 112 or multiple integratedcircuit chips 114 may be separately, or at least partiallyintegrated/collected, and then electrically connected to an externalcontrol circuit board. In other embodiments, the gate driver circuit1161, the gate driver circuit 1162, the integrated circuit chip 112 ormultiple integrated circuit chips 114 may be located outside of thesubstrate 100 instead of being disposed on the substrate 100, whileusing a circuit board to be electrically connected to the bonding pad110 and provide driving signals.

In some embodiments, the driving unit 108 (such as the integratedcircuit chip 112, the integrated circuit chip 114, the gate drivercircuit 1161 or the gate driver circuit 1162) may be disposed on thesubstrate 100 via a chip bonding process. In some embodiments, thedriving unit 108 may be electrically connected to the bonding pads ofthe substrate 100 through a flexible printed circuit (FPC). In someembodiments, the driving unit 108 may be formed on a flexible film (forexample, formed as a chip on film, COF) and electrically connected tothe bonding pads on the substrate 100.

It is worth noting that, an abovementioned concept of reducing aquantity of signal lines electrically connected to the display unit DUor the sensor unit SU using the demux unit 106 in the peripheral regionPR may be applied in the remaining embodiments of the presentdisclosure. The quantity of the display scan lines electricallyconnected to the gate driver circuit 1161 or the gate driver circuit1162 may also be reduced through a demux unit.

The electronic device of the present disclosure is not limited to theabovementioned embodiments; other embodiments will be disclosed in thedescription below. However, for simplicity and to emphasize differencesbetween each embodiment and the aforementioned embodiments, identicalreference signs will be used for identical components and will not bedescribed repeatedly.

Please refer to FIG. 4 and FIG. 5, FIG. 4 is a schematic diagram of anelectronic device according to a second embodiment of the presentdisclosure, and FIG. 5 is a schematic diagram of a demux unit accordingto the second embodiment of the present disclosure. A difference betweenthe present embodiment and the first embodiment is that the demux 106 ofthe present embodiment (as shown in FIG. 4) may further include a demuxunit 130 and a demux unit 132. The demux unit 130 and the demux unit 132may be disposed on opposite sides of the active region AR in the firstdirection D1. For example, the demux unit 130 may be disposed betweenthe gate driver circuit 1161 and the active region AR, and the demuxunit 132 may be disposed between the gate driver circuit 1162 and theactive region AR, but the present disclosure is not limited thereto.

As shown in FIG. 5, wherein a portion of the demux unit 130 is shown asan illustrative example, the demux unit 130 may include a plurality ofthin film transistors TQ that are arranged, for example, as twotransistor columns, and the gates of the thin film transistors TQ ofeach transistor column may be electrically connected to a switch signalline LS. For example, a display scan line L12 a and a display scan lineL12 b may be electrically connected to the thin film transistors TQ of atransistor column TC1; a sensing scan line L22 a and a sensing scan lineL22 b may be electrically connected to the thin film transistors TQ of atransistor column TC2. The display scan line L12 a and the sensing scanline L22 a may be electrically connected to a signal line L3 throughthin film transistors TQ in different transistor columns; the displayscan line L12 b and the sensing scan line L22 b may also be electricallyconnected to another signal line L3 through thin film transistors TQ ofdifferent transistor columns. In FIG. 5, the display scan lines L12 andthe sensing scan lines L22 may be alternately disposed; the thin filmtransistors TQ electrically connected to the display scan lines L12 andthe thin film transistors TQ electrically connected to the sensing scanlines L22 may also be alternately disposed, but the present disclosureis not limited thereto. In such manner, a condition in which the displayscan line L12 b and the sensing scan line L22 b crossing over each otherin the peripheral region PR may be avoided. Additionally, an end ofevery signal line L3 may be electrically connected to a bonding pad 134,and the bonding pad 134 may be electrically connected to the gate drivercircuit 1161 of FIG. 4. In other embodiments, in which the gate drivercircuit 1161 is not an integrated circuit chip, the bonding pad 134 isnot required.

In other words, within the peripheral region PR, an M signal lines mayinclude an M3 display scan lines L12 and an M4 sensing scan lines L22,“M” is a number of the quantity of the signal lines, “M3” is a number ofthe quantity of the display scan lines L12, and “M4” is a number of thequantity of the sensing scan lines L22. The M3 display scan lines L12are electrically connected to the display unit DU, and the M4 sensingscan lines L22 are electrically connected to the sensor unit SU; here,M3 may be greater than M4, but the present disclosure is not limitedthereto. In other embodiments, M3 may be equal to or less than M4.Additionally, the demux unit 130 may be used to electrically connect theabovementioned M signal lines (such as the display scan lines L12 or thesensing scan lines L22) to the N signal lines (such as the signal linesL3), or the display unit DU and the sensor unit SU may both beelectrically connected to the N signal lines through the M signal lines,wherein “N” is a number of the quantity of the signal lines, and M isgreater than N. The numbers M3 and M4 may be positive integers (ornatural numbers not including zero). In this manner, a quantity ofsignal lines within the peripheral region PR may be reduced along withthe cost of production, time, or the space occupied by the signal lineswithin the peripheral region PR.

When the sub-sensor unit SSU is to be driven, the thin film transistorTQ of the transistor column TC2 may be turned on through one of theswitch signal lines LS, and when the sub-pixel SP is to be driven, thethin film transistor TQ of the transistor column TC1 may be turned onthrough another one of the switch signal lines LS. By turning on thethin film transistors TQ of different transistor columns, signal linesL3 may transmit signals to the desired display scan lines L12 or thesensing scan lines L22. However, the quantity of display scan lines L12or the quantity of sensing scan lines L22 that maybe electricallyconnected to one signal line L3 is not limited to what is shown in FIG.5. The demux unit 132 may also have technical features identical orsimilar to those mentioned above; for the sake of brevity, such featureswill not be described.

On the other hand, the present embodiment is different from the firstembodiment in that an area of the sensor unit SU of the presentembodiment (shown in FIG. 4) may be smaller than an area of the sensorunit SU of the first embodiment, but the present disclosure is notlimited thereto. Additionally, the demux 106 of the present embodimentmay include two demux units 102 and one demux unit 104, and the demuxunit 104 may be disposed between two demux units 102, but the presentdisclosure is not limited thereto. Wherein, one of the demux units 102may be electrically connected to a portion of the data lines L14, andthe other demux unit 102 may be electrically connected to anotherportion of the data lines L14. Additionally, the demux units 102 and thedemux unit 104 may be electrically connected to the same integratedcircuit chip 136 of the driving unit 108 through the signal lines L2,and the integrated circuit chip 136 may be electrically connected to thegate driver circuit 1161 and the gate driver circuit 1162, but thepresent disclosure is not limited thereto.

Furthermore, please refer to FIG. 6, which is a schematic diagram of ademux unit according to a third embodiment of the present disclosure.The present embodiment differs from the second embodiment in that, inthe present embodiment, the demux units 102 electrically connecting thedata lines L14 and the demux unit 104 electrically connecting thesensing lines L24 in FIG. 4 may be integrated into one demux unit 138.For example, the demux unit 138 may include a plurality of thin filmtransistors TM arranged into two transistor rows, and the gates of thethin film transistors TM of every transistor row may be electricallyconnected to one switch signal line LS. For example, a data line L14 mand a data line L14 n may be electrically connected to the thin filmtransistors TM of the transistor row TR1, and a sensing line L24 m and asensing line L24 n may be electrically connected to the thin filmtransistors TM of a transistor row TR2. The data line L14 m and thesensing line L24 m may be electrically connected to a signal line L2through the thin film transistors TM of different transistor rows, andthe data line L14 n and the sensing line L24 n may also be electricallyconnected to another signal line L2 through the thin film transistors TMof different transistor rows. In FIG. 6, the data lines L14 and thesensing lines L24 may be alternately disposed; the thin film transistorsTM electrically connected to the data lines L14 and the thin filmtransistors TM electrically connected to the sensing lines L24 may alsobe alternately disposed, but the present disclosure is not limitedthereto. In such manner, a condition in which the data lines L14 and thesensing lines L24 crossing over each other in the peripheral region PRmay be avoided. Additionally, an end of every signal line L2 may beelectrically connected to a bonding pad 140, and the bonding pad 140 maybe electrically connected to an integrated circuit chip. In otherembodiments, the bonding pads 140 may not be required.

Please refer to FIG. 7, which is a schematic diagram of an electronicdevice according to a fourth embodiment of the present disclosure. Adifference between the present embodiment and the first embodiment isthat the demux unit 102 and the demux unit 104 of the present embodimentmay be disposed on opposite sides of the active region AR in the seconddirection D2; the integrated circuit chip 112 and the integrated circuitchip 114 may also be disposed on opposite sides of the active region ARin the second direction D2, but the present disclosure is not limitedthereto. In such manner, a condition in which the data lines L14 and thesensing lines L24 crossing over each other in the peripheral region PRmay be avoided. On the other hand, an area of the sensor unit SU of thepresent embodiment may be smaller than an area of the sensor unit SU ofthe first embodiment, but the present disclosure is not limited thereto.

Please refer to FIG. 8, which is a schematic sectional view of anelectronic device according to a fifth embodiment of the presentdisclosure. The electronic device 10 may include a substrate 100, asubstrate 200 and a liquid crystal layer 300. The substrate 100 and thesubstrate 200 may be disposed opposite each other, and the liquidcrystal layer 300 may be disposed between the substrate 100 and thesubstrate 200. Additionally, a sealant 302 may be disposed between thesubstrate 100 and the substrate 200 and on a perimeter of the liquidcrystal layer 300. The display unit DU (such as the sub-pixels SP), thedemux unit 102 and the integrated circuit chip 112 maybe disposed on thesubstrate 100, and the sensor unit SU (such as the sub-sensor unitsSSU), the demux unit 104 and the integrated circuit chip 114 may bedisposed on the substrate 200, but the present disclosure is not limitedthereto. In other embodiments, the display unit DU, the demux unit 102or the integrated circuit chip 112 may also be disposed on the substrate200; on the other hand, the sensor unit SU, the demux unit 104 or theintegrated circuit chip 114 may also be disposed on the substrate 100.In other embodiments, the demux unit 102, the demux unit 104, thesealant 302 or the liquid crystal layer 300 may also be overlapped alonga normal direction of the substrate 100.

The substrate 200 may have a surface 2001 and a surface 2002 that areopposite to each other, and the sensor unit SU, the demux unit 104 andthe integrated circuit chip 114 of the present embodiment may bedisposed on the surface 2001, but the present disclosure is not limitedthereto. Additionally, the electronic device 10 may include a spectralmodulation structure 146 disposed on the surface 2001. The spectralmodulation structure 146 may include a color filter or quantum dotlayers to modulate a spectrum of light passing through, in order toachieve an effect of color or brightness adjustment. The spectralmodulation structure 146 may also include a black matrix to separatedifferent regions of the spectral modulation structure 146 so as todifferentiate the display units, but the present disclosure is notlimited thereto. The electronic device 10 may further include abacklight module (not shown) disposed adjacent to the substrate 100 andemitting in a V direction; a greyscale of the brightness of theelectronic device 10 may be adjusted through a liquid crystal displayunit DU with a polarizer.

Within the peripheral region PR, the data lines L14 on the substrate 100may extend to the demux unit 102, an end of one of the data lines L14may be electrically connected to the demux unit 102, and another end ofone of the data lines L14 may be electrically connected to the displayunit DU (or the sub-pixel SP) inside the active region AR. The demuxunit 102 may electrically connect to the integrated circuit chip 112through the signal lines L2 a. For example, an end of one of the signallines L2 a may electrically connect to a bonding pad, and the bondingpad may electrically connect to a bonding pad on the integrated circuitchip 112 through a conductive element 118. The conductive element 118may, for example, include an anisotropic conductive film (ACF), but thepresent disclosure is not limited thereto.

On the other hand, the sensing lines L24 on the surface 2001 of thesubstrate 200 may extend to the demux unit 104. An end of one of thesensing lines L24 may be electrically connected to the demux unit 104,and another end of one of the sensing lines L24 may be electricallyconnected to the sensor unit SU (or the sub-sensor unit SSU) inside theactive region AR. The demux unit 104 may electrically connect to theintegrated circuit chip 114 through the signal lines L2 b. For example,an end of one of the signal lines L2 b may be electrically connected toa bonding pad, and the bonding pad may be electrically connected to abonding pad of the integrated circuit chip 114 through a conductiveelement 120. The conductive element 120 may for example include ananisotropic conductive film (ACF), but the present disclosure is notlimited thereto. In some embodiments, the integrated circuit chip 114may be omitted; or the integrated circuit chip 114 may be disposed on asurface 1002 of the substrate 100; or the demux unit 104 may beelectrically connected to the integrated circuit chip 112 disposed onthe substrate 100 or other integrated circuit chips.

Within the active region AR, a non-transparent element 122 may bedisposed on the substrate 100 and located on a side of each sub-pixelSP; or, the non-transparent element 122 may be disposed between adjacentsub-pixels SP, but the present disclosure is not limited thereto. Thenon-transparent element 122 may, for example, include the display scanlines L12, the data lines L14, the thin film transistors, or othernon-transparent elements or non-transparent layers, but the presentdisclosure is not limited thereto. When the sensor unit SU is an opticalsensor unit, a semiconductor material of a PIN-type diode utilized inthe sub-sensor unit SSU may be non-transparent. Therefore, along the Vdirection, the sub-sensor unit SSU may be disposed on thenon-transparent element 122 and not overlap with the sub-pixel SP at anaperture that allows light to pass through, such that light from thebacklight module may pass through the sub-pixel SP without being blockedby the sub-sensor unit SSU. By hiding the non-transparent element 122under the sub-sensor unit SSU, an aperture ratio of the sub-pixel SP andan amount of light passing through may be increased. The direction Vmay, for example, be a direction perpendicular to a surface of thesubstrate 100, but the present disclosure is not limited thereto. Insome embodiments, the sub-sensor unit SSU may also overlap with the thinfilm transistor TD of the sub-pixel SP, but not overlap with theelectrode ED (such as a pixel electrode) of the sub-pixel SP.Additionally, the thin film transistors TD (not shown in FIG. 8) of thesub-pixels SP may be disposed between the liquid crystal layer 300 andthe substrate 100 or between the liquid crystal layer 300 and thesubstrate 200; the electrodes ED (such as a pixel electrode, not shownin FIG. 8) of the sub-pixels SP may be disposed between the liquidcrystal layer 300 and the substrate 100 or between the liquid crystallayer 300 and the substrate 200, but the present disclosure is notlimited thereto.

In some embodiments, if the semiconductor material of the PIN-type diodeis transparent, the sub-sensor unit SSU may overlap with the sub-pixelSP. In some other embodiments, the sensor unit SU may be a capacitivesensor unit. In such scenarios, since the electrode of the sub-sensorunit SSU may be transparent (with high transmittance) and have minimaleffect on the light passing through the sub-pixel SP, the sub-sensorunit SSU may overlap, partially overlap, or not overlap at all with thesub-pixel SP. The sensor unit SU may also include an ultrasonic sensor,an infrared (IR) sensor or other suitable types of sensors. When thesensor unit SU includes IR sensors, the sub-sensor unit SSU may beconfigured at a position away from metal layers of the electronic device10, in order to prevent IR sensors being affected by the metal layers.

As shown in FIG. 8, the electronic device 10 may further include anadhesive layer 123, a polarizer 124, an adhesive layer 126 and a cover128. The adhesive layer 123 may be disposed on the surface 2002 of thesubstrate 200, the polarizer 124 may be disposed on the adhesive layer123, the cover 128 may be disposed on an outermost side of theelectronic device 10, and the adhesive layer 126 may be disposed betweenthe cover 128 and the polarizer 124, but the present disclosure is notlimited thereto. On the other hand, the substrate 100 may also have asurface 1001 and a surface 1002 that are opposite each other. Thedisplay unit DU, the demux unit 102 and the integrated circuit chip 112of the present embodiment may be disposed on the surface 1002.Additionally, the electronic device 10 may further include a polarizer142 and an adhesive layer 144. The polarizer 142 and the adhesive layer144 may be disposed on the surface 1001 of the substrate 100, and theadhesive layer 144 may be disposed between the polarizer 142 and thesubstrate 100. For example, the polarizer 124 and the polarizer 142 mayinclude linear polarizers, circular polarizers, polarizers with phaseretardation layers, polarizers with anti-reflection layers or polarizerswith explosion-proof layers, and the cover 128 may include a coverglass, but the present disclosure is not limited thereto.

It is worth noting that, the abovementioned concept of reducing aquantity of signal lines electrically connected to the display unit DUor the sensor unit SU by the demux 106 (such as the demux unit 102 orthe demux unit 104) in the peripheral region PR of the first embodimentmay also be applied in the present embodiment.

Please refer to FIG. 9, which is a schematic sectional view of anelectronic device according to a sixth embodiment of the presentdisclosure. The present embodiment is different from the fifthembodiment in that the sensor unit SU (such as the sub-sensor unitsSSU), the demux unit 104 and the integrated circuit chip 114 of thepresent embodiment may be disposed on the surface 2002 of the substrate200, but the present disclosure is not limited thereto. Additionally,the sensing lines L24, the signal lines L2 b or other signal lines (suchas the sensing scan lines L22) may also be disposed on the surface 2002of the substrate 200, but the present disclosure is not limited thereto.

Additionally, the electronic device 10 may selectively include aprotective layer 148 disposed on the surface 2002 of the substrate 200and at least cover the sensor unit SU, the demux unit 104, theintegrated circuit chip 114, the sensing lines L24 or the signal linesL2 b, but the present disclosure is not limited thereto. The protectivelayer 148 may include transparent insulating materials, and theinsulating materials may include organic materials, inorganic materials,or a combination of aforementioned materials, but the present disclosureis not limited thereto. The adhesive layer 123, the polarizer 124, theadhesive layer 126 and the cover 128 may be disposed on the protectivelayer 148 in an order as described, but the present disclosure is notlimited thereto. In some embodiments, the protective layer 148 may beomitted, and the adhesive layer 123 may be used to cover the sensor unitSU, the demux unit 104, the integrated circuit chip 114, the sensinglines L24 or the signal lines L2 b, but the present disclosure is notlimited thereto.

It is worth noting that, the abovementioned concept of reducing aquantity of signal lines electrically connected to the display unit DUor the sensor unit SU by the demux 106 (such as the demux unit 102 orthe demux unit 104) in the peripheral region PR as mentioned in thefirst embodiment may also be applied in the present embodiment.

Please refer to FIG. 10, which is a schematic sectional view of anelectronic device according to a seventh embodiment of the presentdisclosure. The present disclosure is different from the fifthembodiment in that the sensor unit SU (such as the sub-sensor unitsSSU), the demux unit 104 and the integrated circuit chip 114 of thepresent embodiment may be disposed on the surface 1001 of the substrate100, but the present disclosure is not limited thereto. Additionally,the sensing lines L24, the signal lines L2 b and other signal lines(such as the sensing scan line L22) may also be disposed on the surface1001 of the substrate 100, but the present disclosure is not limitedthereto. In the present embodiment, the demux unit 102 may be disposedon the surface 1002 (which may also be called a first surface) of thesubstrate 100, the demux unit 104 may be disposed on the surface 1001(which may also be called a second surface) of the substrate 100, andthe surface 1001 may be located on a different side (or an oppositeside) of the substrate 100 relative to the surface 1002.

Additionally, the electronic device 10 may selectively include aprotective layer 148 disposed on the surface 1001 of the substrate 100and at least cover the sensor unit SU, the demux unit 104, theintegrated circuit chip 114, the sensing lines L24 or the signal linesL2 b, but the present disclosure is not limited thereto. The adhesivelayer 144 may be disposed between the polarizer 142 and the protectivelayer 148, but the present disclosure is not limited thereto. In someembodiments, the protective layer 148 may be omitted, and the adhesivelayer 144 may be used to cover the sensor unit SU, the demux unit 104,the integrated circuit chip 114, the sensing lines L24 or the signallines L2 b, but the present disclosure is not limited thereto. In thepresent embodiment, the sensor unit SU may include ultrasonic sensors orother suitable types of sensors.

It is worth noting that, the abovementioned concept of reducing aquantity of signal lines electrically connected to the display unit DUor the sensor unit SU by the demux 106 (such as the demux unit 102 orthe demux unit 104) in the peripheral region PR as mentioned in thefirst embodiment may also be applied in the present embodiment.

Please refer to FIG. 11, which is a schematic sectional view of anelectronic device according to an eighth embodiment of the presentdisclosure. The present disclosure is different from the fifthembodiment in that the demux unit 102 and the demux unit 104 of thepresent embodiment may be both disposed on the surface 1002 of thesubstrate 100. As an example, the sensor unit SU (such as the sub-sensorunits SSU), the integrated circuit chip 114, the sensing lines L24, thesignal lines L2 b or other signal lines (such as the sensing scan linesL22) may also be disposed on the surface 1002 of the substrate 100, butthe present disclosure is not limited thereto.

The sub-sensor units SSU, the sensing lines L24 or the sensing scanlines L22 (not shown in FIG. 11) may be disposed on the non-transparentelements 122 (such as the display scan lines L12, the data lines L14etc.) or the thin film transistors TD of the sub-pixels SP, and thedemux unit 104 may be disposed on the demux unit 102, but the presentdisclosure is not limited thereto. On the other hand, the signal line L2b of the present embodiment may have a folded portion. The foldedportion may for example be the conductive line along an inclined surfaceor the conductive line inside the through hole, wherein a portion of thesignal line L2 b may be disposed on the signal line L2 a, and anotherportion of the signal line L2 b may be disposed on the same surface asthe signal line L2 a after being folded, but the present disclosure isnot limited thereto. Additionally, the signal lines L2 a and the signallines L2 b may all be electrically connected to the integrated circuitchip 112 through the conductive element 118; therefore, the electronicdevice 10 of the present embodiment may omit the integrated circuit chip114, but the present disclosure is not limited thereto.

Please refer to FIG. 12, which is an enlarged schematic top view of aregion Rx in FIG. 11. In the region Rx, when the signal lines L2 a andthe signal lines L2 b extend on the same surface, the signal lines L2 amay be separate from the signal lines L2 b such that the signal lines L2a and the signal lines L2 b may be electrically insulated. For example,the signal lines L2 a and the signal lines L2 b may be alternatelydisposed (as shown in FIG. 12), or the signal lines L2 a and the signallines L2 b may be separated by different regions, but the presentdisclosure is not limited thereto.

It is worth noting that, the abovementioned concept of reducing aquantity of signal lines electrically connected to the display unit DUor the sensor unit SU by the demux 106 (such as the demux unit 102 orthe demux unit 104) in the peripheral region PR as mentioned in thefirst embodiment may also be applied in the present embodiment.

Please refer to FIG. 13, which is a schematic sectional view of anelectronic device according to a ninth embodiment of the presentdisclosure. The present embodiment is different from the eighthembodiment in that the sub-pixels SP of the display unit DU of thepresent embodiment may include self-emitting organic light-emittingdiodes (OLEDs) or inorganic light-emitting diodes (LEDs), and thin filmtransistors that are electrically connected to the organiclight-emitting diodes or inorganic light-emitting diodes. The electronicdevice of the present embodiment may choose not to be configured with abacklight module. The OLED or the inorganic LED may include at least anupper electrode, a lower electrode and an organic or inorganiclight-emitting material between the upper and the lower electrode, whilethe lower electrode may be electrically connected to the thin filmtransistor. Each OLED or inorganic LED may be disposed inside an openingof a pixel defining layer (PDL). A region of the sub-pixel SP of thepresent embodiment may be defined by the opening of the PDL, but thepresent disclosure is not limited thereto. Additionally, thenon-transparent elements 122 of the present embodiment may for exampleinclude the display scan lines L12, the data lines L14, common voltagelines, power lines or other non-transparent elements, but the presentdisclosure is not limited thereto.

Since the semiconductor material of the PIN-type diode utilized in thesub-sensor unit SSU may be non-transparent, the sub-sensor unit SSUshould avoid overlapping with a region occupied by the sub-pixels SPhaving self-emitting diodes in the V direction, so as not to affect theluminous efficacy; the non-transparent element 122 may be disposed nextto a side of the diode or disposed under the diode, so as not to affectthe luminous efficacy. In some embodiments, if the semiconductormaterial of the PIN-type diode is transparent, the sub-sensor unit SSUand the sub-pixel SP may be overlapped. In some other embodiments, thesensor unit SU may be a capacitive sensor unit. In such scenarios, sincethe electrode of the sub-sensor unit SSU may be transparent (with hightransmittance) and have minimal effect on the light passing through thesub-pixel SP, the sub-sensor unit SSU may selectively overlap, partiallyoverlap, or not overlap at all with the sub-pixel SP.

Additionally, the electronic device 10 may include a protective layer150 and an insulating layer 152 while omitting the substrate 200 of theeight embodiment. The protective layer 150 may be disposed between thedisplay unit DU and the sensor unit SU, the insulating layer 152 may atleast cover the sensor unit SU or the demux unit 104, but the presentdisclosure is not limited thereto. The adhesive layer 123, the polarizer124, the adhesive layer 126 and the cover 128 may be disposed on theprotective layer 148 in the order as described, but the presentdisclosure is not limited thereto. As an example, the protective layer150 may include a composite layer of inorganic/organic/inorganicmaterials, and the insulating layer 152 may include insulatingmaterials, but the present disclosure is not limited thereto. Thepolarizer 124 of the present embodiment may include circular polarizersto provide anti-reflection effects, and the electronic device 10 of thepresent embodiment may omit the polarizer 142 and the adhesive layer 144of the eighth embodiment, but the present disclosure is not limitedthereto. Furthermore, the signal lines L2 a and the signal lines L2 b inthe region Rx may have the features as shown in FIG. 12; for the sake ofbrevity, please refer to descriptions in the eighth embodiment, and theyare not redundantly described herein.

It is worth noting that, the abovementioned concept of reducing aquantity of signal lines electrically connected to the display unit DUor the sensor unit SU by the demux 106 (such as the demux unit 102 orthe demux unit 104) in the peripheral region PR as mentioned in thefirst embodiment may also be applied in the present embodiment.

In summary, an electronic device of the present disclosure integratesthe display unit and the sensor unit inside the active region, whereinthe display unit and the sensor unit may both be electrically connectedto N signal lines within a peripheral region through M signal lines, andM may be greater than N. Herein, a demux may be used to electricallyconnect the M signal lines to the N signal lines. In this manner, aquantity of the signal lines within the peripheral region may bereduced, and a production cost, time, or a space occupied by the signallines within the peripheral region may also be lowered.

Even though embodiments and advantages of the present disclosure havebeen described as above, it should be understood that those skilled inthe art may modify, substitute or amend features of the presentdisclosure depending on design requirements without departing from theessence and scope of the present disclosure, so long as the features donot interfere with each other and an essence of the disclosure ismaintained. Any modification, equivalent substitutions and improvementsencompassed by the essence of the present disclosure should beconsidered as being within the scope of the present disclosure.

What is claimed is:
 1. An electronic device, comprising: a display unit;a sensor unit; M first signal lines; and N second signal lines; whereinthe display unit and the sensor unit are both electrically connected tothe N second signal lines through the M first signal lines, M and N arenatural numbers, and M is greater than N.
 2. The electronic deviceaccording to claim 1, further comprising a demux, wherein the demux isused for electrically connecting the M first signal lines with the Nsecond signal lines.
 3. The electronic device according to claim 2,further comprising a driving unit, wherein the driving unit is used forelectrically connecting the N second signal lines.
 4. The electronicdevice according to claim 1, wherein the M first signal lines compriseM1 data lines and M2 sensing lines, the M1 data lines are electricallyconnected to the display unit, the M2 sensing lines are electricallyconnected to the sensor unit, and M1 and M2 are natural numbers.
 5. Theelectronic device according to claim 4, wherein M1 is greater than M2.6. The electronic device according to claim 2, wherein the demuxcomprises a first demux unit and a second demux unit, the first demuxunit electrically connects the display unit, and the second demux unitelectrically connects the sensor unit.